Hybridization for high-speed low inductance electrical interconnects

Flip chip is ideal for module size reduction and low parasitic connections . This is particularly important for high frequency operation above 4-5GHz. This approach is also crucial for VCSEL arrays (8x8, 12x12). Flip chip is definitely the packaging solution permitting the lasers to be considered electrically equivalent as regard to the driving circuitry. IntexyS patented underfilling technology permits to remove substrate for back emission 850nm VCSELs.

IntexyS Flip Chip technologies open the way for extremely high parallel optical data rates :