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| Wafer scale hybrid integration technology for low cost photonics multi-chip modules |
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| IntexyS technological platform covers: | ||
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HF, Optical & Mechanical Design |
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Silicon interconnection networks |
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State of the art Flip Chip technology (*) | |
| - Ultra-fine pitch, - Under-filling - Substrate removal - Flip Chip Hybridization on silicon based motherboard - Direct Hybridization on Silicon, GaAs IC’s - Multi level flip chip hybridization - Simultaneous Electrical and Mechanical Connections with XYZ Sub-micronic self positioning accuracy |
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| (*)CEA licensed technology | ||
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