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Low cost Passive alignment manufacturing
 

IntexyS hybridization technologies can be used to accurately align optical components, (FP or DFB lasers, VCSELs , waveguides, Lens, Fiber…..) along the three axis enabling passive alignment with a collective manufacturing approach. These technics can be mixed with the conventional V-Groove on silicon benches.

   
Sub-micronic XYZ positioning
  << 1µm high density bumps capability High density bumps capability (10µm @15µm pitch) enables component positioning with high wafer uniformity, repeatability and accuracy.
   
Underfill/backside processing
 

- Full Wafer removal or
micro-machining
- Lens integration on the backside
of VCSELs.
   
Various bumps size in 1 shot
 

- Z positioning along an optical axis
- Multi level hybridization
- Angle hybridization