|
|||||||||||||||||||||||||||||
| Integration platform | ||
IntexyS hybridization technologies can be used on: |
||
| - Passive substrates: Silicon Electro-optical bench, Quartz, - Active substrates: High speed Integrated circuit's (Si, III-V...) |
||
Silicon Interconnection board can integrate: |
||
| - Low loss microwave lines up to 40GHz - resistors, inductances, capacitances - V-Groove, deep RIE etched-through holes. - Bumping……. |
||